ch9-1

IC fabrication layout
category of integration
there are SSI which is small scale integration,MSI meduim scale integration, LSI large scale integration, and VLSI which is very large scale integration.
there are seven steps of IC fabrication
1- crystal growth
2- epetaxial growth
3- oxidation
4- photolithography
a- mask production
b- photoetching
5- diffusion
6-ion impalntation
7- metalization
1- which responsipole on the making the base of chip which name is substrate.
2- making another layer above the one.
3- making sio2 above the epitaxial layer.
4- making first a mask of the circuit design and the using a photo transister as a thin layer the it exposure with ultra violt for making an opening
5- diffuse the empurities over the openings
6- making ion implantation as another way for impurities.
7- making the wiring between the areas.
so the it perform the interconnections of components on this chip, which performed by deposision of thin film of aluminuim or gold over the entire surface, a mask is used to define the connection pattern between component and unwanted Aluminuim is removed